Innovation Day To Celebrate Hybrid Tech

SAN JOSE, CA — NextFlex is hosting a flex tech gala featuring some of the biggest names in technology and manufacturing on Aug. 8 in San Jose.

Boeing, GE and Lockheed Martin represent a few companies set to demonstrate the latest innovations in flexible hybrid electronic technology during Innovation Day, featuring ways to:

• Explore 60 exhibit tabletop demonstrations
• Attend a riveting panel discussion on the future of this type of technology, with panelists slated to include Boeing, Lockheed and the U.S. Department of Defense
• Tour NextFlex’s Technology Hub
• Discover FlexFactor educational program outcomes
• Celebrate NextFlex and Partners’ collaborative projects

NextFlex — America's Flexible Hybrid Electronics Manufacturing Institute— was formed through a cooperative agreement with the U.S. Department of Defense as a consortium of companies, academic institutions and nonprofits as well as state, local and federal governments.

Those interested may get a glimpse of the event by reviewing last year’s Innovation Day 2018 recap!

Innovation Day is slated for NextFlex’s headquarters located at 2244 Blach Place, Suite 150 in San Jose.

Participants of Innovation Day 2019:

· Acellent

· Boeing

· DuPont

· Eastman Chemical Co.

· GE Global Research

· Hitachi Chemical

· Innovize

· Jabil

· Kuprion

· Lockheed Martin

· NASA Ames Research Center

· NextFlex

· SI2 Technologies, Inc.

· UMass Lowell

· Universal Instruments Corp

· US Army Research Lab

See also

• Silicon Valley Students Take On Steep Competition, World Problem